3M Canada

Scotch-Weld™ 021200-87837 2-Part Non-Corrosive Epoxy Potting Compound/Adhesive, 400 mL Duo-Pak Cartridge, Part A: Clear/Part B: Black, 48 hr at 72 deg F Curing

7100082565 MFG #: 021200-87837
$277.64 / EA
Estimated Delivery 7 to 10 Business Days
Scotch-Weld™ 021200-87837 2-Part Non-Corrosive Epoxy Potting Compound/Adhesive, 400 mL Duo-Pak Cartridge, Part A: Clear/Part B: Black, 48 hr at 72 deg F Curing
  • Manufacturer: 3M
  • Type: 2-Part Non-Corrosive
  • Container Type: Duo-Pak Cartridge
  • Container Size: 400 mL
  • Net Weight: Base: 9.6 to 9.7 lb/gal/Accelerator: 8.0 to 8.2 lb/gal
  • Base Type: Epoxy
  • Composition: Part A: 4-Nonylphenol, Branched with Isomers, 4,4'-Methylenebis (2-Methylcyclohexylamine), Benzyl Alcohol/Part B: Epoxy Resin, Hydrocarbon Resin, Carbon Black
  • Form: Liquid
  • Coverage: 320 sq-ft/gal
  • Drying Time: 15 min Air/10 min Force
  • Application Time: 70 min
  • Setting Time: 3 hr
  • Curing Time: 48 hr at 72 deg F
  • Color: Part A: Clear/Part B: Black
  • Odor/Scent: Part A: Very Mild Pungent/Part B: Very Mild
  • Temperature Rating: 72 deg F
  • Specific Gravity: Part A: 1/Part B: 1.15
  • Flash Point: Part A: >240 deg F/Part B: >200 deg F
  • Mixing Ratio: 0.042361111111111106
  • VOC Content:
  • Viscosity Rating: Part A: 12000 to 15000 cPs/Part B: 13000 to 16000 cPs
  • Flammability Rating: 1
  • Applicable Materials: Metal
  • Shear Strength: 2500 psi
  • Brand: Scotch-Weld™
Scotch-Weld™ Epoxy Potting Compound/Adhesive, 2-Part Non-Corrosive, Duo-Pak Cartridge Container, 400 mL Container, Epoxy Base, Composition: Part A: 4-Nonylphenol, Branched with Isomers, 4,4'-Methylenebis (2-Methylcyclohexylamine), Benzyl Alcohol/Part B: Epoxy Resin, Hydrocarbon Resin, Carbon Black, 70 min Work Life, 3 hr Functional Cure, 48 hr at 72 deg F Curing, Part A: Clear/Part B: Black, 72 deg F, 1:1 Mixing Ratio,
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  • Rigid potting compound is non-corrosive to copper
  • Minimal exotherm and very low shrinkage
  • Low viscosity epoxy resin system designed primarily for potting, sealing and encapsulation of many e
  • Offers good thermal shock resistance and excellent retention of electrical insulation properties und
Rigid potting compound is non-corrosive to copper
Minimal exotherm and very low shrinkage
Low viscosity epoxy resin system designed primarily for potting, sealing and encapsulation of many electronic components
Offers good thermal shock resistance and excellent retention of electrical insulation properties under high humidity conditions