Scotch-Weld™ 021200-20854 2-Part General Purpose Epoxy Adhesive, 1 qt Kit, Part A: Amber/Part B: Transparent, 30 days at 72 deg F Curing
7000000861
MFG #: 021200-20854
$560.77
/ EA
Estimated Delivery 7 to 10 Business Days
- Manufacturer: 3M
- Type: 2-Part General Purpose
- Container Type: Kit
- Container Size: 1 qt
- Net Weight: Base: 9.4 to 9.8 lb/gal/Accelerator: 8 to 8.5 lb/gal
- Base Type: Epoxy
- Composition: Part A: Aliphatic Polymer Diamine, Bis 3-Aminoprpyl) Ether of Diethylene Glycol, Toluene/Part B: Epoxy Resin
- Form: Viscous
- Coverage: 320 sq-ft/gal
- Drying Time: 15 min Air/10 min Force
- Application Time: 120 min
- Setting Time: 14 hr
- Curing Time: 30 Days at 72 deg F
- Color: Part A: Amber/Part B: Transparent
- Odor/Scent: Part A: Pungent/Part B: Epoxy
- Temperature Rating: 72 deg F
- Specific Gravity: Part A: 0.97/Part B: 1.17
- Flash Point: Part A: >/=94 deg C/Part B: 248 deg C
- Mixing Ratio: 0.042361111111111106
- VOC Content: 3.9 g/L
- Viscosity Rating: Part A: 7000 cPs/Part B: 14000 cPs
- Flammability Rating: 1
- Applicable Materials: ABS, Acrylic, Ceramic, EPDM Rubber, Glass, Hardboard, High Performance Nylon, Metal, PVC and Wood
- Shear Strength: 1700 psi
- Brand: Scotch-Weld™
Scotch-Weld™ Epoxy Adhesive, 2-Part General Purpose, Kit Container, 1 qt Container, Epoxy Base, Composition: Part A: Aliphatic Polymer Diamine, Bis 3-Aminoprpyl) Ether of Diethylene Glycol, Toluene/Part B: Epoxy Resin, 120 min Work Life, 14 hr Functional Cure, 30 days at 72 deg F Curing, Part A: Amber/Part B: Transparent, 72 deg F, 1:1 Mixing Ratio, 3.9 g/L VOC, For Use On: ABS, Acrylic, Ceramic, EPDM Rubber, Glass, Hardboard, High Performance Nylon, Metal, PVC and Wood
- Maintains a strong bond under expansion, contraction and limited movement while retaining good stren
- Excellent for cryogenic bonding applications or adhering substrates that will be exposed to extreme
- Medium viscosity help minimize running, dripping, or migration while also self-leveling
- Versatile bonding agent will adhered a wide variety of similar and dissimilar substrates, including
- Can be heat cured to reduce curing times from 7 days to as a little as 30 min
Maintains a strong bond under expansion, contraction and limited movement while retaining good strength after environmental aging
Excellent for cryogenic bonding applications or adhering substrates that will be exposed to extreme cold
Medium viscosity help minimize running, dripping, or migration while also self-leveling
Versatile bonding agent will adhered a wide variety of similar and dissimilar substrates, including metals and masonry
Can be heat cured to reduce curing times from 7 days to as a little as 30 min